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Which thermal material suits chip testing?

Q: Is heat dissipation really the root cause of repeated yield fluctuations, equipment downtime, and soaring costs in the chip testing process?

Imagine this: expensive testing machines are roaring, engineers are staring at the screens, and groups of data are jumping. Suddenly, the alarm light flashes - the chip temperature is out of control! The test is interrupted, the expensive probe card may be damaged, and the yield judgment of the entire batch of chips is questionable. This scenario is repeatedly staged in the testing workshops of high-end chips (especially GPUs, CPUs, and AI chips). Tracing back to the source, the problem often lies in that inconspicuous but crucial thermal interface material!

Traditional thermal conductive gaskets struggle in thepressure cooker" environment of chip testing: high-frequency probe pressing, harsh temperature cycles (-40℃ to 200℃+), micron-level undulations on the chip surface... They either have a soaring thermal resistance (thermal conductivity of only 1-6W/mK), leading to heat accumulation, out-of-control chip junction temperature, and distorted test signals; or they have permanent deformation and weak resilience, unable to continuously fill gaps, resulting in poor contact and numerous hot spots; they may even generate excessive stress, damaging precious chips or probes. The result? Erratic test data, inexplicable yield fluctuations, frequent equipment downtime for maintenance, and a sharp reduction in the lifespan of probe cards - every heat dissipation failure is eating into profits!

The key to breaking the situation lies in a revolutionary material that can beboth rigid and flexible": high thermal conductivity and high resilience carbon fiber thermal pad (15-45W/mK). This is by no means an ordinary gasket; it is a heat dissipation and buffering expert specially designed to conquer the extreme working conditions of chip testing! Its core secret lies in the unique carbon fiber matrix structure: ultra-high thermal conductive channels (15-45W/mK) are like building an efficient highway network, instantlydraining" the huge amount of heat generated by the chip, far exceeding the capabilities of traditional silicone pads by several times or even more than ten times. At the same time, the extreme softness and ultra-high resilience (>50%) endow it with extraordinaryadaptive" ability. No matter how the probe is pressed repeatedly or how uneven the chip surface is, it can instantly fill every micro-gap likeliquid metal", and rebound quickly after the pressure is released, always maintaining a tight, stable, and low thermal resistance contact interface.

In the actual chip testing battlefield, thisblack technology" material is showing its prowess:

On the ATE testing machine, facing thousands of test cycles per second, the carbon fiber thermal pad is atemperature stabilizer". It ensures that the junction temperature of the device under test (DUT) is always controllable, allowing every electrical signal test to be carried out in a fair and stable thermal environment. The accuracy of yield judgment is greatly improved, eliminating the trouble of datadancing". A packaging and testing giant introduced the 15W/mK version in high-end GPU testing, and the yield fluctuation was directly reduced by 30%, so that the test engineers could finally sleep soundly.

In the harsh Burn-in test room, it is adurability guard". Under the torture of long-term high temperature and high pressure (sometimes up to hundreds of hours), its super thermal conductivity continuously and efficiently conducts heat, preventing early failure of the chip caused byheat accumulation; at the same time, its excellent resilience stubbornly resists material creep, avoiding poor contact and heat dissipation failure caused by gasketcollapse" in the later stage of the test, ensuring the effectiveness of the entire aging cycle.

In the precision probe card and test socket, it turns into astress eliminator" andhot spot killer". It closely fills the micron-level gaps that may exist between the IC and the heat sink or the socket base plate, eliminates local hot spots, protects fragile solder balls and micro-bumps from thermal stress damage, and at the same time extends the service life of the valuable probe card.

In the system-level test (SLT) which is closer to the real application environment, it is acontinuous escort". It provides long-term, stable and reliable heat dissipation guarantee for high-power chips, ensures the test coverage and result credibility in complex scenarios, and accelerates product launch.

Choosing it is not just choosing a gasket, but choosing afast track" for cost reduction and efficiency improvement:

Stable yield: A stable thermal environment = stable electrical signals = more authentic and reliable test results, significantly reducing misjudgments (Overkill/Underkill) and improving the final factory yield.

Reduced costs: Equipment downtime due to overheating? Frequent replacement of probe cards? Forced interruption of tests? These money-burning scenarios are greatly reduced! Improve equipment utilization and reduce maintenance costs and accidental downtime losses. The aforementioned packaging and testing factory saved more than 180,000 yuan per month.

Increased efficiency: Supporting higher test power and longer continuous stable operation, the test process can be accelerated, and production capacity is naturally improved.

Worth the investment: Although the unit price is higher than that of ordinary gaskets, the yield improvement, equipment protection, time saving and cost reduction it brings make its ROI (Return on Investment) extremely impressive, and it is a realcost reduction and efficiency improvement" weapon.

In today's era of soaring chip performance and exponentially increasing testing challenges, heat dissipation is no longer a supporting role, but a key link that determines the success or failure of testing. High thermal conductivity and high resilience carbon fiber thermal conductive pad (15-45W/mK), with their disruptive performance combination, are quickly becoming anessential" cornerstone for the stability and reliability of high-end chip testing. It solves not only heat dissipation problems, but also yield fluctuations, cost out-of-control, and efficiency bottlenecks.

Is your test line still paying for heat dissipation problems? Contact us immediately to obtain carbon fiber thermal conductive gasket solutions for your specific testing challenges (ATE, Burn-in, SLT...), and use arock-solid" material to lock in test yield and achieve double victories in efficiecy and cost!